Incoming material
Part numbers, package information, quantities, photographs, and the incoming condition help establish the starting point. For previously processed material, earlier test results or process history may also be relevant.
PRECISION IN MEMORY
Built around
the memory
that matters.
DRAM IC processing, memory PCB and module manufacturing. Every project starts with the actual part, the intended result, and the checks that matter.
DRAM IC PROCESSINGPCB & MODULESTESTING & REPAIR
Memory, from IC to module ILLUSTRATION
1.2MMonthly memory module capacity
4,000 m²Fenggang SMT factory floor area
100+Customers in China and abroad
10SMT production lines
2Manufacturing facilities
DRAM IC / ILLUSTRATIVE VISUALOne focus.
Connected capabilities.
We provide DRAM IC reballing, mechanical surface grinding and laser remarking, configuration conversion, and testing. Our memory PCB and module manufacturing capabilities support projects that extend beyond the chip.
We work with sourcing and engineering teams to confirm the incoming part, target result, and acceptance requirements. From there, we can agree on the process and delivery scope.
View all servicesCAPABILITIESFrom component
From component
to module.
Specialist services that can stand alone or connect across a memory product program. Each project is reviewed against its own materials, specifications, and intended use.
01 / COMPONENT
DRAM IC processing
Reballing, surface grinding and laser remarking, configuration conversion, and IC testing.
02 / CIRCUIT
Memory PCB
PCB design, development, and manufacturing for memory products.
03 / ASSEMBLY
Module manufacturing
SMT assembly and related manufacturing for DDR3 and DDR4 memory modules.
04 / SUPPORT
Testing & repair
Memory module testing and repair, with the work scoped to the reported issue.
PROJECT INFORMATIONDetails that help us
Details that help us
assess your project.
A brief description is enough to begin. Part details, the intended result, and acceptance needs help us define the work together.
Target result
The target ball array, approved marking, desired organization, module specification, or reported issue gives the work a clear purpose. For configuration conversion, the original and target device specifications need review.
Acceptance requirements
Inspection points, test scope, samples, records, and acceptance criteria can be defined for the particular job. The goal is a shared understanding of what the completed work should demonstrate.
SMT WORKSHOPMANUFACTURING FOUNDATIONReal facilities.
Real facilities.
Clear processes.
Our memory module process brings together solder paste printing, component placement, reflow soldering, optical inspection, and board separation. Explore our workshop and see where each machine fits.
DRAM IC processing has its own requirements. We review the part number, package, and intended result before agreeing on the process and checks for a chip project.
Explore our equipmentINSIDE OUR WORKSHOPA closer look at
A closer look at
the manufacturing floor.
Step inside our SMT and testing areas to see the equipment behind memory module production.
PROJECT WORKFLOWFrom project review
From project review
to delivery.
We review the incoming part and target result, agree on the processing and acceptance requirements, then complete the defined work and checks.
01
Review
Confirm the part, incoming condition, intended use, and target result.
02
Agree
Define the processing route, samples, inspection points, and acceptance criteria.
03
Process
Carry out the agreed chip processing, PCB work, or module manufacturing.
04
Deliver
Complete the agreed checks and hand over the material and records.
A CLOSER LOOKMachinery with
Machinery with
a purpose.
See the equipment we use in memory module manufacturing. The gallery follows the production sequence from solder paste printing through placement, reflow, inspection, and separation.
See the equipment
YAMAHA YSM20R / PLACEMENTCERTIFICATE RECORDSOur management system
Our management system
certificate scans.
We share the English-language certificate scans issued to Dongguan Tiancun Electronic Technology Co., Ltd. Their stated scope is “Processing of memory strips.”
The scans show a valid-through date of 29 October 2026. Current renewal status is still being verified; see the certificate page for the stated scope and dates.
View certificate detailsCOMMON QUESTIONSUseful answers
Useful answers
before we talk.
Project feasibility depends on the exact part and intended result. These answers explain how an initial discussion typically begins.
Can we help with a single IC processing step?
Yes. You can discuss reballing, surface grinding and laser remarking, configuration conversion, or testing as a separate service. We confirm the scope against the device and its condition.
How is a DRAM configuration conversion assessed?
We review the original part number, target requirements, and sample or validation needs before recommending a route.
How is laser remarking handled?
We remove the existing package mark mechanically, then laser mark the approved information. We check the new mark against the true device identity and agreed processing details.
What information helps us assess a project?
A part number, package photos, quantity, incoming condition, target result, and any test or acceptance requirements are useful. A short description is enough to start a conversation.
LET'S TALK MEMORYYour next project
Your next project
starts with a conversation.
We welcome inquiries about a single IC processing step or a connected PCB and module project.
Contact Tynsen