OUR SERVICES

Specialist services across memory manufacturing.

From an individual DRAM IC processing step to a project connecting PCBs and memory modules, we work around the product and its intended use.

Our SMT workshopTynsen photo
PROJECT INFORMATION

Details that help us assess the work.

Part or module details, incoming condition, and the intended result give us a starting point. Any missing information can be clarified as the project progresses.

For chip processing

Share the part number, package photos, quantity, current marking or organization, and the required result. Samples or prior test data may help clarify feasibility.

For PCB and assembly

Share target module requirements, board drawings if available, the DRAM parts, quantity, and any handling or test expectations.

For testing and repair

Describe the observed issue, the affected products, and any previous results. These details guide the discussion of checks and corrective work.

PROJECT WORKFLOW

From requirements review to delivery.

Engineering, production, quality, and customer service support the stages relevant to the agreed project scope.

01

Review the device, incoming condition, and intended result

02

Agree on the process, inspection points, and acceptance criteria

03

Carry out the agreed processing or manufacturing

04

Complete the agreed checks and hand over the material and records

AGREED DELIVERABLES

What the completed work includes.

Before work begins, we can agree on processed material, samples, inspection points, test scope, marking information, and any records needed at handover.

NEXT STEP

Let's discuss
what comes next.

We welcome a conversation about your memory project.

Discuss a project