01 / PRINTINGGKG G9 solder paste printer
Printing lays down solder paste where components will be joined to the PCB. Stencil, board design, materials, and deposit requirements are reviewed for the module being built.
MANUFACTURING EQUIPMENT
The machines behind memory module manufacturing.
Our memory module process connects solder paste printing, component placement, reflow soldering, AOI, and board separation. Explore the equipment used at each stage.
Tynsen photoTHE LINE AT A GLANCE
From PCB to finished module.
Printing, placement, soldering, inspection, and board separation work together in module assembly. The applicable equipment and checks depend on the product specification.
01
Solder paste printing
02
Component placement
03
Reflow soldering
04
Automated optical inspection
05
Board separation
MACHINE GALLERY
Equipment for each production stage.
The machines below support SMT and memory module manufacturing. DRAM IC reballing, grinding, conversion, and chip testing are separate services with their own process requirements.
01 / PRINTING
02 / PLACEMENTYamaha YSM10
Our YSM10 places DRAM packages and other components on prepared PCBs according to the approved assembly data.
02 / PLACEMENTYamaha YSM20R
Our YSM20R supports the placement stage between solder paste printing and reflow. Machine setup follows the approved module requirements.
03 / SOLDERINGReflow soldering
The populated board passes through a controlled heating process to form solder joints. A suitable profile depends on the PCB, components, solder paste, and product requirements.
04 / INSPECTIONAutomated optical inspection
AOI supports visual review of assembled boards against defined features. Inspection points and acceptance criteria are established for the product; optical inspection is distinct from functional testing.
05 / SEPARATIONEM-5700N depaneling
This machine separates assembled memory boards from the production panel. Panel layout, board dimensions, and handling requirements influence how separation is planned.
FROM LINE TO MODULE
Equipment serves a defined product.
The right build depends on the board design, materials, machine setup, process conditions, and inspection requirements. The DDR4 module shown below is one example; each new project is defined by its own specifications.
THE TEAM AROUND THE MACHINES
Equipment is one part of the process.
Engineering, production, and quality functions work from the approved product and process requirements. Testing and acceptance arrangements are agreed for the specific project.
EQUIPMENT & PROJECT SCOPE
Confirming the production scope.
We confirm the applicable equipment, process route, inspection coverage, and delivery requirements for each module project. Machine specifications do not represent a guaranteed production capacity or yield.
NEXT STEPLet's discuss
Explore module manufacturing Let's discuss
what comes next.
We welcome a conversation about your memory project.